PCB cov txheej txheej thev naus laus zis hais txog cov txheej txheej sib txuas (plating) txheej sib txuas rau cov txheej txheem sib txuas (thiab tiv thaiv) txheej .
Kev faib tawm los ntawm kev siv:
1.} rau nplaim tooj liab yuav tsum tau tiv thaiv los ntawm txheej txheej txheej txheej, tsis li nws yooj yim rau hauv huab cua .
2.} rau txuas: electropating ni / au lossis tshuaj lom neeg plating ni / au (nyuaj kub, muaj p thiab co co)
3.} rau xaim vuam: Tus txheej txheem hlau
Cov cua kub leveling (hall lossis hal)
Tus qauv ntawm flattening tus PCB tuaj tawm ntawm Molten Sn / PBTENT SOLDER los ntawm huab cua kub (230 degree).
1. yooj yim yuav tsum:
(1) {{. sn / pb =63 / 37 (qhov hnyav piv)
(2). Coating thickness at least>3UM
(3) zam dhau kev tsim ntawm tsis-solderable cu3sn {} Qhov laj thawj yog dhau nyias, xws li sn Cu3sn
2. txheej txheem ntws
Tshem tawm cov tsis kam-board tu-luam ntawv cov npog ntsej muag thiab cov cim cim-tu-thov flux-kub cua lev
